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Heat Sinks by Application: Transistor-outline (TO) package
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TO Packages
The transistor-outline (TO) package was developed from early experience with transistors. It was a reliable package that only required increasing the number of leads to make it useful for ICs. Leads normally number between 2 and 12, with 10 being the most common for IC applications. Pencom’s TO packages are available in low-power to high-power models in either surface mount or single in-line applications. Our global manufacturing capability enables us to deliver a low cost with short lead times for standard and custom packages.
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