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Thermal Components
Pencom’s global manufacturing facilities along with our expert thermal engineers, make Pencom the leading OEM heat sink supplier. Our thermal team is designed to produce the right component while producing a cost effective solution for your thermal requirements. Whether you need a custom fabrication job or a simple extrusion, Pencom can provide you with a step by step solution for all of your thermal needs for low, medium and high volume production.
Heat Sinks by Application:
Active Fan Sink
AGP and Chipset
Board Level
High Power
Microprocessor
DC/DC Converter
TO Packages
Heat Sinks by Manufacturing Method:
Extrusions
Forged Fin
Cross Cut
Complex Milling
Folded Fin
High Aspect Ratio
Multi-technology
Skived
Attachment Method:
Screws
Spring Loaded Pins
Clips
Custom Attachment
Thermal Interfaces:
Thermal Pads
Thermal Grease
Thermal Tape