Board Level Heatsinks

BGA heat sinks are usually manufactured out of various materials and manufacturing methods to provide a board level cooling solution. Two types of BGA heatsinks include active and passive. Passive heatsinks are designed to use the ambient airflow to dissipate the heat, while the active BGA heatsink uses an active fan to provide spot cooling for a specific component. Pencom manufactures BGA heatsinks for short and long term applications with various attachment methods. Pencom’s forged fin heat sinks with elliptical fins provide excellent pressure-drop characteristics for passive and active cooling.