AGP and Chipset Heatsinks

Usually designed as an Active fan heat sink, these thermal components are designed to spot cool Northbridge, Southbridge, and Video processors of today’s newest microprocessors. Also engineered with heat pipes, these thermal coolers are designed around other components such as motherboards, and video cards to provide high end cooling with the smallest profile available. Pencom designs its AGP and Chipset coolers to each individual application to provide an custom cooling component to ensure your thermal design offers the lowest thermal resistance. Our global manufacturing capability allows us to provide our customers with a low cost solution for short term and long term applications.